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• Contact probe capabilities
• BGA, QFN and QFP Test Sockets
• Direct Attach
• Lid Styles
• Heat Sinks

Overview

Using the latest in pogo pin technology, our Sales and Mechanical Engineers will work with you to provide the best solution for your testing needs. We can provide you with high performance test socket solutions for both your engineering/lab applications as well as high volume production requirements.

Our state of the art solid modeling CAD/CAM technology allows us to take your package dwg and design a custom Test socket to be delivered within 3-4 weeks. M&M sockets are designed for BGA, LGA, QFN, MLF, QFP, SOIC, and TSSOP packages from 0.3mm to 1.27mm pitch.

All of our sockets are designed to meet or exceed your electrical testing and mechanical requirements, for applications of several MHz up to 20+GHz frequencies. Our high quality spring probe contacts are capable of handling leaded and lead-free packaging materials, and with minimal cleaning can handle in excess of 500K insertions in many cases. Whether your application is RF, high current, high speed, low inductance, fine pitch, low inductance, low resistance, or Kelvin, M&M has a cost effective and reliable solution for your testing needs.

We us the latest in ESD rated plastic materials and each socket and lid part can be easily replaced on site by the customer or by one of our local support technicians. We provide full maintenance support services at our Arizona factory in a matter of days instead of weeks.

Our high mechanical advantage lids and low profile sockets are designed to reach exceptional performance levels. All of our custom designs are modeled and approved by the customer before they are manufactured, allowing you to add or request specific features to be designed into the socket or lid to accommodate load board component placement or air increased air flow to the top of the IC.

Contact probe capabilities

• Wide selection of probes from .3mm to 1.27mm pitch.
• Pins with measured bandwidth for 25GHz at -1dB.
• Reliable pins with insertions >500K cycles in most cases.
• Lead free solutions
  • Increased yields
  • Less cleaning
  • Preserves PCB’s contact surface.
  • Reduces cost of test.
• Conductive Elastomer for High speed lab testing available.

BGA, QFN and QFP Test Sockets

M&M sockets can handle packages from 1mm to greater than 50mm and from 0.3mm pitch to 1.27mm pitch. Most BGA sockets use a floating plate design to help locate the device before contact with the spring probes, ensure continuity, and to act as a hard stop during test to protect the pins and the package. For smaller RF, QFN, and QFP style packages that require a shorter travel pin, we can utilize a 2 plate system that uses a shelf for aligning the package. We offer a variety of hand test lid options depending on the application and engineering needs. All lids are easily removed from the socket bases for a quick change from manual to handler and back.

Direct Attach

Lid Styles

1. Standard Lid: Double-Clamping with spring loaded pressure block. Most commonly and best used on small devices (BGA, QFN, etc), QFP,TSSOP, Direct Attach, etc. Provides easy attachment and removal as well as automatic adjustment for package thickness variances.
2. Linkage Style Lid: Provides better mechanical advantage than the Standard Lid and utilizes easy attachment and removal as well as a spring loaded pressure block for automatic adjustment. This can be used with Large BGA’s (up to about 40 mm), Small devices (BGA, QFN, etc.) but should be kept to relatively low force applications (~under 75 lbs (although exceptions can be made if footprint requires)). Not recommended for use with QFP or TSSOP.
3. Z-Adjust (Removable Clamshell) Lid: Provides better mechanical advantage than Standard Lid (and somewhat better than the Linkage lid…but a lot better on larger devices) and can adjust for package thickness variance. Utilizes ergonomic handle that conforms to SEMI S8-1103 ergonomic guidelines. Directly attaches to socket and provides best option for achieving continuity. Can be made to use for all devices, although not usually used for QFP’s or TSSOP’s (it still could be used for these, just that it would had considerable height to the full assembly.
4. High Force, Low Friction, Z-Adjust, Ball-Bearing Lid: This a removable clamshell design as well and provides the best mechanical advantage for Large Devices with High Pin counts. Utilizes a double ball-bearing design that results in Low Friction and optimal mechanical advantage when actuating Large Devices. Provides the best ergonomics when operating high force sockets. Recommended for sockets with total forces above 80-90 lbs.

Lids 3 & 4 can made with an optional Heat Sink and/or Fan depending on the thermal requirements from the customer. And all Lids are made with Die Probe Access Holes, sizes can vary based on the size of the lid and/or whether the customer wants to utilize a thermocouple in that same access hole.

Heat Sinks